글로벌 Peer 불러오는 중…
산업별 글로벌 동종업체의 매출·수익성·밸류에이션을 USD 기준으로 비교
한국 기업의 위치는 글로벌 안에서 봐야 보입니다. 동일 산업의 글로벌 리더들과 매출 규모·수익성·밸류에이션을 나란히 놓고 비교합니다.
| 기업 | 국가 | 매출 | 영업이익률 | 순이익률 | ROE | PER | PBR | EV/EBITDA |
|---|---|---|---|---|---|---|---|---|
| Apple (시스템)7_응용/시스템 | US | $416.2B | 32.0% | 26.9% | 151.9% | — | — | — |
| TSMC (파운드리)4_제조(Foundry/IDM) | TW | $115.4B | 53.9% |
| 44.6% |
| 31.5% |
| — |
| — |
| — |
| Dell Technologies (PC/서버)7_응용/시스템 | US | $113.5B | 7.8% | 5.2% | -240.3% | — | — | — |
| Broadcom (반도체설계)3_설계(Fabless) | US | $63.9B | 40.8% | 36.2% | 28.4% | — | — | — |
| HP Inc (PC/프린터)7_응용/시스템 | US | $55.3B | 5.8% | 4.6% | -730.9% | — | — | — |
| Intel (반도체제조)4_제조(Foundry/IDM) | US | $52.9B | -4.2% | -0.5% | -0.2% | — | — | — |
| Qualcomm (모바일AP)3_설계(Fabless) | US | $44.3B | 30.1% | 12.5% | 26.1% | — | — | — |
| Micron (메모리)4_제조(Foundry/IDM) | US | $37.4B | 26.1% | 22.8% | 15.8% | — | — | — |
| AMD (반도체설계)3_설계(Fabless) | US | $34.6B | 10.7% | 12.3% | 6.8% | — | — | — |
| Arrow Electronics (유통)8_유통/판매 | US | $30.9B | 3.0% | 1.9% | 8.7% | — | — | — |
| Avnet (반도체유통)8_유통/판매 | US | $22.2B | 2.8% | 1.1% | 4.8% | — | — | — |
| ASE Technology (후공정패키징)5_패키징/테스트 | TW | $19.6B | 8.0% | 6.2% | 11.7% | — | — | — |
| MediaTek (모바일AP)3_설계(Fabless) | TW | $18.1B | 17.4% | 17.8% | 25.9% | — | — | — |
| Texas Instruments (아날로그IC)6_모듈/부품 | US | $17.7B | 35.4% | 28.1% | 30.6% | — | — | — |
| NXP (차량용반도체)6_모듈/부품 | NL | $12.8B | 24.8% | 16.9% | 20.6% | — | — | — |
| Analog Devices (아날로그IC)6_모듈/부품 | US | $11.0B | 27.3% | 20.6% | 6.7% | — | — | — |
| Western Digital (스토리지)4_제조(Foundry/IDM) | US | $9.5B | 22.4% | 19.3% | 33.2% | — | — | — |
| Seagate (스토리지)4_제조(Foundry/IDM) | US | $9.1B | 20.2% | 16.1% | -324.3% | — | — | — |
| Renesas Electronics (MCU/차량)6_모듈/부품 | JP | $8.5B | 15.2% | -3.9% | -2.1% | — | — | — |
| Marvell (반도체설계)3_설계(Fabless) | US | $8.2B | 39.6% | 32.6% | 18.7% | — | — | — |
| UMC (파운드리)4_제조(Foundry/IDM) | TW | $7.2B | 20.9% | 16.9% | 11.0% | — | — | — |
| GlobalFoundries (파운드리)4_제조(Foundry/IDM) | US | $6.8B | 14.2% | 13.1% | 7.4% | — | — | — |
| Amkor Technology (후공정패키징)5_패키징/테스트 | US | $6.7B | 7.0% | 5.6% | 8.3% | — | — | — |
| ARM (반도체IP)3_설계(Fabless) | GB | $6.1B | 18.5% | 18.4% | 10.9% | — | — | — |
| ON Semiconductor (전력반도체)6_모듈/부품 | US | $6.0B | 1.4% | 2.0% | 1.6% | — | — | — |
| Skyworks Solutions (RF칩)6_모듈/부품 | US | $4.1B | 13.6% | 11.7% | 8.3% | — | — | — |
| Monolithic Power (전력IC)6_모듈/부품 | US | $2.8B | 26.1% | 22.3% | 17.6% | — | — | — |
| Onto Innovation (검사)5_패키징/테스트 | US | $1.0B | 13.2% | 13.6% | 6.5% | — | — | — |
| Silicon Motion (낸드컨트롤러)4_제조(Foundry/IDM) | US | $0.9B | 10.5% | 13.8% | 14.8% | — | — | — |
| Cohu (테스트장비)5_패키징/테스트 | US | $0.5B | -15.4% | -16.4% | -9.5% | — | — | — |
| Aehr (번인테스트)5_패키징/테스트 | US | $0.1B | -9.6% | -6.6% | -3.2% | — | — | — |
| NVIDIA (반도체설계)3_설계(Fabless) | US | — | — | — | — | — | — | — |
| Infineon (전력반도체)6_모듈/부품 | DE | — | — | — | — | — | — | — |
| STMicroelectronics (차량/산업)6_모듈/부품 | NL | — | — | — | — | — | — | — |